Manufacturing Technology 2010, 10(1):16-19 | DOI: 10.21062/ujep/x.2010/a/1213-2489/MT/10/1/16

Modelling of Transient Thermal Stress in Layered Walls

Šuba Oldřich, Sýkorová Libuše, Malachová Martina, Sámek David
Thomas Bata Univerzity in Zlín, Faculty of Technology, Department of Production Engineering

Results of FEM modelling of transient thermal stress analysis in layered walls are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of transient thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB boards with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.

Keywords: transient thermal stress analysis, layered walls, PCB boards, FEM modelling

Published: December 1, 2010  Show citation

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Šuba O, Sýkorová L, Malachová M, Sámek D. Modelling of Transient Thermal Stress in Layered Walls. Manufacturing Technology. 2010;10(1):16-19. doi: 10.21062/ujep/x.2010/a/1213-2489/MT/10/1/16.
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    References

    1. BÍLEK, O.; LUKOVICS, I. (2006). Determination of the Residual Stress through the Thickness of Plastics and Metallic Parts. Manufacturing Technology, J. for Science, Res. and Production. December 2006, vol VI, Ústí nad Labem, p. 12-16, ISSN 1213248-9
    2. BÍLEK, O., LUKOVICS, I. (2009). FEM Application for Highspeed Grinding Process. In Lehocky, L. (ed.). XXIII. microCAD. Miskolc, 19. - 20. March. 2009, p. 21-26. ISBN 978-963-661-878-0
    3. JANÁČOVÁ, D., KOLOMAZNÍK, K., VAŠEK, V., MOKREJŠ, P. (2007). Separation of Printed Circuit Board by Temperature Shock, WSEAS World Science and Engineering Academy and Science, The 5th WSEAS Conference on Heat Transfer, Thermal Engineering and Environment HTE'07, Athens, 2007, 268-271, ISBN-ISSN 978-960-6766-02-2
    4. JANÁČOVÁ, D., KOLOMAZNÍK, K., VAŠEK, V.(2005). Problems connected with separation of reaction mixture, Bahcesehir University Istanbul, 9th International Research/Expert Conference Trends in the Development of Machinery and Associated Technology TMT 2005, Istanbul, p. 1549-1552, ISBN-ISSN 9958-617-28-5

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