Manufacturing Technology 2025, 25(1):143-151 | DOI: 10.21062/mft.2025.013

Investigation on the Effect of Nano-Cutting Liquid on the Cutting Quality of Large Diameter Silicon Wafer

Wei Zhang ORCID...1,2, Lixian Wang ORCID...2
1 School of Mechanical and Electrical Engineering, Ningbo Polytechnic, Ningbo, 315800, China
2 Ningbo Shuaitelong Group Co., Ltd, Ningbo, 315000, China

To enhance the effective penetration of cutting fluid into the depth of the cutting joint, a nano-cutting liquid atomization method has been proposed to improve the cutting quality of diamond wire sawing. A six-inch large diameter silicon wafer (150 mm diameter) diamond wire saw cutting experimental platform was constructed. The base liquid, nano SiO2, and nano SiC cutting liquid were utilized as the cutting fluids, and various cutting solutions were employed to compare the cutting quality of large diameter silicon wafers. The temperature field change, surface roughness of the silicon wafer, surface morphology, and warping of the silicon wafer were measured as evaluation indexes, and the impact law of different cutting solutions on the cutting quality of diamond wire saw was analyzed. The results indicate that nano-cutting fluid can reduce the roughness of silicon wafers and improve the surface morphology of silicon wafers. Mixing multiple nanoparticles can produce cutting fluids that further enhance wire saw cutting performance in actual diamond wire saw cutting technologies.

Keywords: Diamond Wire Saw, Nano-Sio2 Cutting Fluid, Nano-Sic Cutting Fluid, Silicon Wafer
Grants and funding:

This work has been funded by the Nature Science Foundation of Ningbo No. 2022J179 and NBPT 2022 National scientific research project cultivation subject No. NZ22GJ002

Received: December 2, 2024; Revised: February 28, 2025; Accepted: March 10, 2025; Prepublished online: March 11, 2025; Published: April 25, 2025  Show citation

ACS AIP APA ASA Harvard Chicago IEEE ISO690 MLA NLM Turabian Vancouver
Zhang W, Wang L. Investigation on the Effect of Nano-Cutting Liquid on the Cutting Quality of Large Diameter Silicon Wafer. Manufacturing Technology. 2025;25(1):143-151. doi: 10.21062/mft.2025.013.
Share...
Download citation
  • BibTeX (.bib)
  • Bookends (.ris)
  • EasyBib (.ris)
  • EndNote (.enw)
  • EndNote 8 (.xml)
  • ISI WoS (.isi)
  • Medlars (.medlars)
  • Mendeley (.ris)
  • MODS (.xml)
  • Papers (.ris)
  • RefWorks (.txt)
  • RefManager (.ris)
  • RIS (.ris)
  • MS Word (.xml)
  • Zotero (.ris)
    • Open full article

    References

    1. Lai, Z., Liao, X., Yang, H., Hu, Z., & Huang, H. (2024). Experimental study on the formation mechanism of saw marks in wire sawing. International Journal of Mechanical Sciences, Vol. 265, pp. 108894. https://doi.org/10.1016/j.ijmecsci.2023.108894 Go to original source...
    2. Xie, W., Zhang, Z., Yu, S., Li, L., Cui, X., Gu, Q., & Wang, Z. (2023). High efficiency chemical mechanical polishing for silicon wafers using a developed slurry. Surfaces and Interfaces, Vol. 38, pp. 102833. https://doi.org/10.1016/j.surfin.2023.102833 Go to original source...
    3. Satake, U., Enomoto, T. (2023). Kinematic analysis of double-sided polishing of silicon wafers for improving surface flatness. Procedia CIRP, Vol. 117, pp. 56-61. https://doi.org/10.1016/j.procir.2023.03.011 Go to original source...
    4. Tamil, L.D.S., Gurusamy, A., Kamaraj, J.J.J.J., Krishnan, A., Pichan, K., Pandian, M.S., & Perumalsamy, R. (2024). Investigation of the role of Saw damage in Silver catalyzed Metal Assisted Chemical Etching on Multicrystalline Silicon for Solar cell Application. Silicon, Vol. 16, No. 4, pp. 1689-1702. https://doi.org/10.1007/s12633-023-02774-z Go to original source...
    5. Cheng, D., & Gao, Y.F. (2023). Effect of the diamond saw wires capillary adhesion on the thickness variation of ultra-thin photovoltaic silicon wafers during slicing. Solar Energy Materials and Solar Cell, Vol. 261, pp. 112525. https://doi.org/10.1016/j.solmat.2023.112525 Go to original source...
    6. Wang, Y., Huang, S., Qian, Z., Su, J., & Du, L. (2023). Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw. Engineering Fracture Mechanics, Vol. 278, pp. 109029. https://doi.org/10.1016/j.engfracmech.2022.109029 Go to original source...
    7. Wang, Y., Zhao, B., Huang, S., & Qian, Z. (2021). Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing. Engineering Fracture Mechanics, Vol. 258, pp. 108077. https://doi.org/10.1016/j.engfracmech.2021.108077 Go to original source...
    8. Li, Z., Cai, Y., Wang, Y., & Liu, X. (2023). Slurry pressure at the cutting zone in multi-wire sawing: An experimental study. Journal of Manufacturing Processes, Vol. 106, pp. 130-138. https://doi.org/10.1016/j.jmapro.2023.09.061 Go to original source...
    9. Cheng, D., & Gao, Y. (2024). Fracture probability of PV mono-Si wafers in diamond wire slicing due to coupling of capillary adhesion bending stress and sawing stress. Materials Science in Semiconductor Processing, Vol. 169, pp. 107880. https://doi.org/10.1016/j.mssp.2023.107880 Go to original source...
    10. Qiu, J., Li, X., & Zhang, S. (2021). Research on an improved bath cooling and lubrication method for diamond wire sawing. The International Journal of Advanced Manufacturing Technology, Vol. 112, pp. 2123-2132. https://doi.org/10.1007/s00170-020-06430-3 Go to original source...
    11. Zheng, J., Ge, P., Bi, W., Zhao, Y., & Wang, C. (2022). Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. Solar Energy, Vol. 231, pp. 343-354. https://doi.org/10.1016/j.solener.2021.11.069 Go to original source...
    12. Zheng, J., Ge, M., Ge, P., Xing, X.; Bi, W., & Zhao, Y. (2023). Effect of liquid bridge on the thickness deviation between wafers sawn by diamond wire. Journal of Manufacturing Processes, Vol. 108, pp. 268-279. https://doi.org/10.1016/j.jmapro.2023.11.016 Go to original source...
    13. Karimi, S., Heyhat M.-M., Isfahani, A., & Hosseinian, A. (2020). Experimental investigation of convective heat transfer and pressure drop of SiC/water nanofluid in a shell and tube heat exchanger. Heat and Mass Transfer, Vol. 56, pp. 2325-2331. https://doi.org/10.1007/s00231-020-02844-7 Go to original source...
    14. Li, Z., Liu, X., Jia, H., Yu, J., Cai, Y., & Li, G. (2023). Study on the temperature field in the cutting zone for machining monocrystalline silicon wafer using free abrasive multi-wire saw. Materials Science in Semiconductor Processing, Vol. 161, pp. 107481. https://doi.org/10.1016/j.mssp.2023.107481 Go to original source...
    15. Bako¹ová, D., Bako¹ová, A., Dubcová, P., Ko¹tialiková, D., Dubec, A., Janeková, M. (2024). Effect of Filler Content and Treatment on Mechanical Properties of Polyamide Composites Reinforced with Short Carbon Fibres Grafted with Nano-SiO₂. Manufacturing Technology, Vol. 24, No. 4, pp. 521-531. https://doi.org/10.21062/mft.2024.058 Go to original source...
    16. Dembiczak, T., Kruzel, R., Náprstková, N., Ba³aga, Z., Ku¶mierczak, S., Wachowicz, J., Reszka, P. (2024). Abrasion Wear Analysis of Commercial Cutting Inserts by Ball-on-disc Method. Manufacturing Technology, Vol. 24, No. 5, pp. 738-746. https://doi.org/10.21062/mft.2024.076 Go to original source...
    17. Poro¶, D., Skowronek, H. (2024). Technological Considerations in WEDM of Carbon Fiber Reinforced Silicon Carbide Composites (Cf-SiC). Manufacturing Technology, Vol. 24, No. 6, pp. 940-951. https://doi.org/10.21062/mft.2024.103 Go to original source...
    18. Costa, E.C., Weingaertner, W.L., & Xavier, F.A. (2022). Influence of single diamond wire sawing of photovoltaic monocrystalline silicon on the feed force, surface roughness and micro-crack depth. Materials Science in Semiconductor Processing, Vol. 143, pp. 106525. https://doi.org/10.1016/j.mssp.2022.106525 Go to original source...
    19. Wallburg, F., Kuna, M., Budnitzki, M., & Schoenfelder, S. (2022). A material removal coefficient for diamond wire sawing of silicon. Wear, Vol. 504-505, pp. 204400. https://doi.org/10.1016/j.wear.2022.204400 Go to original source...
    20. Zhao, Y., Ge, P., Bi, W., Zheng, J., & Liu, N. (2023). MRF based image stitching of electroplated diamond wire saw: For improving visual inspection accuracy of manufacturing quality. Measurement, Vol. 208, pp. 112486. https://doi.org/10.1016/j.measurement.2023.112486 Go to original source...
    21. Li, C., Hu, Y., Huang, S.; Meng, B., Piao, Y., & Zhang, F. (2022). Theoretical model of warping deformation during self-rotating grinding of YAG wafers. Ceramics International, Vol. 48, No. 4, pp. 4637-4648. https://doi.org/10.1016/j.ceramint.2021.10.250 Go to original source...
    22. Shanu, A., Sharma, P., & Dixit, P. (2024). Micromachining of alumina ceramic for microsystems applications: a systematic review, challenges and future opportunities. Materials and Manufacturing Processes, Vol. 39, No. 7, pp. 892-924. https://doi.org/10.1080/10426914.2023.2290244 Go to original source...
    23. Liu, M., Ma, B., Wang, C., & Gao, Z. (2024). Welding of pre-brazed diamond grits onto a substrate using nickel-based alloys. Materials and Manufacturing Processes, Vol. 39, No. 2, pp. 217-226. https://doi.org/10.1080/10426914.2023.2187834 Go to original source...
    24. Singh, J., Kant, R., Nimesh, A., Katiyar, N., & Bhattacharya, S. (2024). Evaluating electrochemical micromachining capabilities for industrial applications: A review. Materials and Manufacturing Processes, Vol. 39, No. 1, pp. 1-42. https://doi.org/10.1080/10426914.2023.2219304 Go to original source...

    This is an open access article distributed under the terms of the Attribution-NonCommercial 4.0 International License (CC BY-NC 4.0), which permits non-comercial use, distribution, and reproduction in any medium, provided the original publication is properly cited. No use, distribution or reproduction is permitted which does not comply with these terms.


    Return to the content