Manufacturing Technology 2025, 25(2):185-201 | DOI: 10.21062/mft.2025.022
SEM Analysis of Surface Layers with Variable Ra Parameters for Tribological Optimization in Design Engineering
- 1 Polytechnic Faculty, Calisia University, 4 Nowy ¦wiat street, 62-800 Kalisz, Poland
- 2 Faculty of Mechanical Engineering, Department of Machining, Assembly and Engineering Metrology, VSB - Technical University of Ostrava, 70 800 Ostrava, Czech Republic
- 3 Faculty of Mechanical Engineering, Poznan University of Technology, 3 Piotrowo street, 60-965 Poznan, Poland
- 4 Faculty of Mechanical Engineering, Slovak Technical University, Námestie slobody 17, 812 31 Bratislava 1, Slovakia
In this study, the microstructure of surface layers with varying roughness (Ra parameters) was analyzed using scanning electron microscopy (SEM) to optimize tribological properties in engineering design. SEM revealed key microstructural features – sharp and mild protrusions, pitting, microcracks and contaminants – that were not available in traditional profilometry. Reducing the Ra value improved surface uniformity by reducing irregularities and defect lengths, which had a positive effect on tribological properties and surface durability. However, defects were still present even at Ra < 1.25 μm, indicating the "Law of Microstructural Roughness," which emphasizes the inevitability of surface irregularities despite minimizing roughness. The integration of SEM results with profilometric methods enabled comprehensive identification and assessment of defects, combining microstructure with tribological properties. Results suggest that controlled roughness is key in combining materials and optimizing functional surfaces, particularly in the aerospace, biomedical and automotive industries, where reliability under demanding operating conditions is a priority.
Keywords: Tribology, Surface roughness, SEM analysis, Microstructural defects, Engineering design
Received: January 11, 2025; Revised: March 26, 2025; Accepted: March 26, 2025; Prepublished online: April 24, 2025; Published: May 6, 2025 Show citation
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