Manufacturing Technology 2026, 26(3):307-318 | DOI: 10.21062/mft.2026.025

Study on Removal Mechanism and Surface Topography in Ultrasonic-Assisted Grinding of High Volume Fraction SiCp/Al Composite

Weicheng Guo ORCID..., Hailong Zhang ORCID..., Miaoxian Guo ORCID...

High volume fraction SiCp/Al composites are highly valued in aerospace, automotive, and electronic packaging for their exceptional mechanical and thermal properties. To enhance the machinability of these difficult-to-cut materials, this study systematically evaluates ultrasonic vibration-assisted grinding (UAG) against conventional grinding (CG). Experimental comparisons reveal that UAG lowers grinding forces by up to 26%, a benefit primarily driven by the reduction in undeformed chip thickness (UCT). This kinematic modification optimizes the particle removal mode, thereby mitigating severe particle fracture and interfacial debonding. Crucially, the superior surface integrity observed with UAG results from extending the critical threshold for particle fracture, suppressing roughness accumulation at higher feed rates, and amplifying the load-relief effect of increased spindle speeds. These findings provide both theoretical insights and experimental validation for the high-efficiency machining of SiCp/Al composites.

Keywords: High volume fraction SiCp/Al, Ultrasonic vibration-assisted grinding, Grinding force, Surface topography

Received: January 4, 2026; Revised: April 8, 2026; Accepted: April 20, 2026; Prepublished online: April 29, 2026; Published: June 29, 2026  Show citation

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Guo W, Zhang H, Guo M. Study on Removal Mechanism and Surface Topography in Ultrasonic-Assisted Grinding of High Volume Fraction SiCp/Al Composite. Manufacturing Technology. 2026;26(3):307-318. doi: 10.21062/mft.2026.025.
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    References

    1. LIPIÑSKI, T. (2024). Microstructure and mechanical properties AlSi7Mg alloy with Sr, Al and AlSi7Mg. In: Manufacturing Technology Journal, Vol. 24, No. 2, pp. 227-234. Go to original source...
    2. LI, Q., YUAN, S., BATAKO, A., CHEN, B., GAO, X., LI, Z., AMIN, M. (2024). Modeling for ultrasonic vibration-assisted helical grinding of SiC particle-reinforced Al-MMCs. In: The International Journal of Advanced Manufacturing Technology, Vol. 131, No. 9-10, pp. 5223-5242. Go to original source...
    3. ZHOU, Y., GU, Y., LIN, J., ZHAO, H., LIU, S., XU, Z., YU, H., FU, X. (2022). Finite element analysis and experimental study on the cutting mechanism of SiCp/Al composites by ultrasonic vibration-assisted cutting. In: Ceramics International, Vol. 48, No. 23, pp. 35406-35421. Go to original source...
    4. WANG, L., PAN, Y., ZHU, X. (2023). Effect of milling parameters on the surface roughness of SiCp/Al materials. In: Manufacturing Technology Journal, Vol. 23, No. 4, pp. 545-550. Go to original source...
    5. ZHOU, J., LU, M., LIN, J., WEI, W. (2023). Influence of tool vibration and cutting speeds on removal mechanism of SiCp/Al composites during ultrasonic elliptical vibration-assisted turning. In: Journal of Manufacturing Processes, Vol. 99, pp. 445-455. Go to original source...
    6. WANG, H., ZHANG, H., ZHOU, M., GU, C., BAI, S., LIN, H. (2023). Study of surface defect detection techniques in grinding of SiCp/Al composites. In: Applied Sciences, Vol. 13, No. 21, p. 11961. Go to original source...
    7. YAO, X., YU, W., PENG, J., DING, W., ZHAO, B. (2025). Study on ultrasonic vibration-assisted grinding characteristics of high volume fraction SiCp/Al composites. In: The International Journal of Advanced Manufacturing Technology, Vol. 138, No. 2, pp. 385-400. Go to original source...
    8. HU, C., ZHU, Y., FAN, R. (2024). Experimental studies of the machinability of SiCp/Al with different volume fractions under ultrasonic-assisted grinding. In: Materials, Vol. 17, No. 12, p. 3024. Go to original source...
    9. GU, P., ZHU, C., SUN, Y., WANG, Z., TAO, Z., SHI, Z. (2023). Surface roughness prediction of SiCp/Al composites in ultrasonic vibration-assisted grinding. In: Journal of Manufacturing Processes, Vol. 101, pp. 687-700. Go to original source...
    10. JIN, J., MAO, J., WANG, R., CUI, M. (2025). Experimental study on ultrasonic vibration-assisted grinding of SiCp/Al composites grinding. In: Micromachines, Vol. 16, No. 3, p. 302. Go to original source...
    11. YUAN, Z., XIANG, D., PENG, P., ZHANG, Z., LI, B., MA, M., ZHANG, Z., GAO, G., ZHAO, B. (2023). A comprehensive review of advances in ultrasonic vibration machining on SiCp/Al composites. In: Journal of Materials Research and Technology, Vol. 24, pp. 6665-6698. Go to original source...
    12. ZHOU, Y., TIAN, C., JIA, S., MA, L., YIN, G., GONG, Y. (2023). Study on grinding force of two-dimensional ultrasonic vibration grinding 2.5D-C/SiC composite material. In: Crystals, Vol. 13, No. 1, p. 151. Go to original source...
    13. ZHANG, K., DAI, C., YIN, Z., MIAO, Q., CHEN, J., CHENG, Q., YANG, S. (2024). Modeling and prediction on grinding force in ultrasonic assisted elliptical vibration grinding (UAEVG) of SiC ceramics using single diamond grain. In: Journal of Manufacturing Processes, Vol. 131, pp. 2244-2254. Go to original source...
    14. GAO, X., AN, W., WANG, L., CHEN, B., XU, W., FENG, Q., LI, Q., YUAN, S. (2024). Study on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiC particle-reinforced Al-MMCs. In: Ceramics International, Vol. 50, No. 24, pp. 52742-52760. Go to original source...
    15. CHENG, Q., DAI, C., MIAO, Q., YIN, Z., CHEN, J., YANG, S. (2024). Undeformed chip thickness with composite ultrasonic vibration-assisted face grinding of silicon carbide: Modeling, computation and analysis. In: Precision Engineering, Vol. 86, pp. 48-65. Go to original source...
    16. LI, Y., YANG, Y., XIONG, J., PENG, P., XIANG, D. (2025). Modelling of ultrasonic grinding force considering the wheel topography generated by rotary dressing operation. In: The International Journal of Advanced Manufacturing Technology, Vol. 140, No. 3-4, pp. 1485-1503. Go to original source...
    17. YING, J., YIN, Z., ZHANG, P., ZHOU, P., ZHANG, K., LIU, Z. (2022). An experimental study of the surface roughness of SiCp/Al with ultrasonic vibration-assisted grinding. In: Metals, Vol. 12, No. 10, p. 1730. Go to original source...
    18. ZHOU, J., LU, M., LIN, J., ZHOU, X., GUO, M., DU, Y. (2022). Investigation of surface integrity transition of SiCp/Al composites based on specific cutting energy during ultrasonic elliptical vibration assisted cutting. In: Journal of Manufacturing Processes, Vol. 79, pp. 654-665. Go to original source...
    19. YAO, X., PENG, J., ZHOU, R., WANG, R., LI, G., DING, W., ZHAO, B. (2025). Material removal and damage formation mechanisms during ultrasonic vibration-assisted grinding of high volume fraction SiCp/Al composites. In: Precision Engineering, Vol. 96, pp. 625-639. Go to original source...
    20. CHARDE, M. M., NAJAN, T. P., CEPOVA, L., JADHAV, A. D., RASHINKARD, N. S., SAMAL, S. P. (2025). Predictive modelling of surface roughness in grinding operations using machine learning techniques. In: Manufacturing Technology Journal, Vol. 25, No. 1, pp. 14-23. Go to original source...
    21. ZHU, C., GU, P., WU, Y., LIU, D., WANG, X. (2019). Surface roughness prediction model of SiCp/Al composite in grinding. In: International Journal of Mechanical Sciences, Vol. 155, pp. 98-109. Go to original source...
    22. KNAST, P., PETRÙ, J., LEGUTKO, S., SOOS, L., POKUSOVA, M. (2025). SEM analysis of surface layers with variable Ra parameters for tribological optimization in design engineering. In: Manufacturing Technology Journal, Vol. 25, No. 2, pp. 185-201. Go to original source...

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