Manufacturing Technology 2026, 26(3):258-270 | DOI: 10.21062/mft.2026.035

Gradient Stiffness Modelling of Thin Adhesive Bonds

Kamil Anasiewicz ORCID...
Faculty of Mechanical Engineering, Lublin University of Technology. Nadbystrzycka st. 36, 20-618 Lublin. Poland.

The objective of this study was to evaluate the influence of through-thickness variability of Young’s modulus on the numerical modelling of adhesive joint behaviour. The study combined experimental characterization with finite element simulations. Nanoindentation measurements were used to deter-mine the distribution of Young’s modulus across adhesive layers with thicknesses of 0.05 mm and 0.1 mm. Based on these measurements, two-dimensional finite element models of double-overlap joints were developed in Abaqus. Two modelling approaches were analysed: a conventional homogeneous model with constant material properties and a heterogeneous multi-zone model in which Young’s modu-lus varies across the adhesive thickness and is implemented using the USDFLD user subroutine. The results indicate that incorporating experimentally determined stiffness gradients significantly alters the predicted stress field, particularly in regions near the overlap ends where failure initiation is expected. The heterogeneous model provides improved agreement between numerical predictions and experimen-tally determined failure stresses. These findings demonstrate that accounting for stiffness heterogeneity improves the accuracy of numerical modelling of ultra-thin adhesive joints.

Keywords: Adhesive bonding, Apparent Young’s modulus, Heterogeneity of adhesive joints, FEM

Received: December 3, 2025; Revised: May 19, 2026; Accepted: June 7, 2026; Prepublished online: June 28, 2026; Published: June 29, 2026  Show citation

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Anasiewicz K. Gradient Stiffness Modelling of Thin Adhesive Bonds. Manufacturing Technology. 2026;26(3):258-270. doi: 10.21062/mft.2026.035.
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